NEWS

From August 31 to September 2, 2026, the 14th Semiconductor Equipment, Materials and Core Components Exhibition (CSEAC) will be held at the Taihu Lake International Expo Center in Wuxi.

As one of the most influential events in China's semiconductor industry, CSEAC brings together leading companies and professionals from the fields of semiconductor equipment, materials, and core components, providing an important platform for technology exchange, industry collaboration, and business development.

At the upcoming exhibition, Sense Intelligence will showcase its HPP integrated drive and motion-control solution, designed to reduce equipment response latency through an integrated control architecture and establish efficient coordination between front-end sensing and data acquisition and downstream motion execution. With core capabilities in sub-micron, ultra-high-precision motion control, the solution will be designed to meet the demanding process requirements of advanced semiconductor packaging and micro/nano-scale manufacturing.

By continuously advancing its precision motion-control technologies, Sense Intelligence will help drive the next generation of intelligent manufacturing, enabling industry partners to seize opportunities in the post-Moore era and supporting the continued development of high-end precision manufacturing.