Wafer dicing machine

Related Products: 

Software Defined Motion Controller (APC-M47)

Image acquisition card (PCIe-CPL64V Full)

Multi functional data acquisition card (PCIe-9121)

An integrated motion control and data acquisition solution ensures precise motion and detection of cutting tools to verify the clean and accurate cutting of wafers into independent chips.

Needs and challenges：

1. Compact equipment using EtherCAT solution, requiring higher cutting accuracy

2. Integrate AOI automatic optical inspection system to achieve real-time defect detection

3.2 channels, with a sampling rate of ≥ 62.5 kS/s per channel, used to detect potential defects in rotating tools (75 points collected per rotation at 50000 RPM)

4.2 channels, with a sampling rate of 10 kS/s per channel, used for vibration monitoring

5. The vision system is used for wafer alignment, cutting guidance, and post cutting inspection

Solution：

1. Integrated and modular solutions:

   APC-M47 integrates SuperCAT soft motion control, data acquisition (DAQ), and automatic optical inspection (AOI) into a single controller.

   SuperCAT supports user-defined mapping function, which can flexibly adapt to different models.

2.Precise Multi-channel Data Acquisition:

   Supports a total sampling rate of 400kS/s for 4 channels, enabling detection of 120 sampling points for cutting tools

   Supports 14 bit resolution and can identify subtle cutting defects

   Support channel gain queue function for easy data management

3. High throughput image acquisition capability:

   Supports CameraLink Full camera with a transmission bandwidth of up to 850MB/s, effectively reducing CPU usage