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Die bonder

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Related Products: 

Software Defined Motion Control (APC-M47)

Image/Video Capture Card (PCIe-CPL64V Full)


Accurate chip alignment and stable bonding force are crucial for ensuring reliable chip mounting performance and preventing bump or chip damage.


Challenges faced:

Real time visual motion synchronization for chip positioning

Stable Z-axis pressure control during the bonding process ensures consistent mounting force and prevents chip or bump damage

Integration of Multi Axis Motion and Visual Detection


Solution:

Synchronous Vision Motion Control: The SuperCAT controller collaborates with the CPL64V image acquisition card to achieve synchronization between image acquisition and motion execution, ensuring chip alignment accuracy.

Dynamic compensation and soft landing: SuperCAT supports 1D/2D position error compensation and Z-axis soft landing control to ensure smooth contact and prevent chip or bump damage.

High bandwidth and reliable visual interface: CPL64V supports DMA transfer up to 850 MB/s, with PoCL power supply safety protection and stable image acquisition capability, meeting high-speed detection requirements.


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